Paul Otellini IDF Keynote: $1M challenge, Quad Core, 45nm chips, Cool gadgets and UMPC VW Car
Intel President and CEO, Paul Otellini announced the Core 2 Duo Challenge, an industry award to foster innovation in consumer PCs. The contest will award up to 1 Million dollars to the smallest and most innovatively designed systems based on Intel’s Core 2 Duo chip and Intel’s home entertainment platform Viiv. Paul Otellini made the announcement in the kick off of Intel Developer Forum, Intel’s most important event for technology.
In the words of Intel Corporation’s press release: “On innovation, Otellini challenged the computing and consumer electronics industry to do more, to take advantage of the energy-efficient performance capabilities of Core 2 Duo processors. To do this, Otellini announced the Intel® Core™ Processor Challenge, a contest that will award up to $1 million in prizes to the PC designer or manufacturer that builds the smallest and most stylish PCs powered by an Intel Core 2 Duo processor coupled with Intel® Viiv™ technology, Intel’s premium brand for in-home, media-optimized PCs.”
Additionally to the Core 2 Duo challenge, Paul Otellini showed on stage an impressive array of technologies coming up soon from Intel. Among the technologies that captured most of the attention from the audience were:
· Intel® Core™2 Extreme quad-core processor. Quad core for gaming enthusiasts coming up on November this year.
· Intel® Core™2 Quad processor. Quad Core for mainstream market coming up in first quarter 2007.
· Quad-Core Intel® Xeon® processor 5300 series brand for dual processor servers will be shipped this year, and a new low-power 50-watt Quad-Core Intel® Xeon® processor L5310 for blade servers that will be shipped in the first quarter of 2007.
· Cinema-like gaming experience demonstrated with RemedyTM.
· 45 nm technology on track for 2H 2007 production. Three large fabs ready or under construction with 1M sq ft of clean room facilities for a total investment of $9B USD.
· Paul Otellini demonstrated the world’s first teraflop on a chip wafer.
· Paul talked about Broadband to Go with WiMax enabling high-speed connections anywhere.
· Paul demonstrated an Ultra Mobile PC connected wirelessly to deliver video and location-based services.
· Paul demonstrated a VW car that is capable of interacting via WiFi with a UMPC to download video, music and content off the Internet.
· Paul demonstrated a Classmate PC, an affordable notebook PC for children on Emerging Markets.
A picture story of the keynote coming up soon here. In the mean time, what do you think about the $1M award? Will it bring exciting designs to the marketplace (or most importantly, to the living room)?
